Real Time observation of void formation using X-ray

With the continuous quest for higher yields in electronics production, the problem of void formation in solder joints, particularly in BGAs and QFNs, is now very much in focus.

The xReflow Heated Stage, is a software PID controlled IR Micro heater, which can be mounted inside almost any off-line X-Ray system to observe void and defect formation during reflow, as it happens.

The PCB with components and solder paste is positioned in the oven ready for observation. The X-Ray tube is positioned, with magnification and focus set for the area of interest, the image can be either a perpendicular or oblique view.

When setup is complete, the X-Ray is switched to view live images, the xReflow heating cycle is started and the entire reflow process can be observed (and recorded) in real-time.

As voids and defects form, we can observe them, note the part of the reflow cycle they occur and start to investigate how to eliminate them. This allows us to modify the reflow cycle to reduce voiding or defect formation on problem components or areas of the assembly. All profile parameters can be modified allowing the best possible results to be achieved.

Our customers also use xReflow to evaluate new solder pastes and other joining materials. Advanced joining material suppliers also use this system as part of their product development process.

xreflow video
video mobile
xreflow heated stage logo light

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Heating is achieved with a 500W Quartz IR Bottom side heater element and 2x angled 250W Quartz IR Topside heaters
Each slightly offset to allow clear X-ray observation during the heating cycle.

LED - Perpendicular view
LED - Angled view
QFN - Showing voiding in the central pad
BGA - Showing head on pillow defect

Click to enlarge

xReflow heat stage

Technical Specifications

Bottom Heater500w Quartz IR, 120mm x 240mm heating area
Top Heaters2 x 250w Quartz IR, 60mm x 120mm heating areas
ControlPID controller using thermocouples on PCB and/or in Solder Joints
ConstructionOpen architecture, mainly of aluminium materials
Base Plate Size
Nominally 600mm x 350mm (w x d), adaptable to suit X-ray system
Max. PCB size6” x 4” (150mm x 100mm)

Global Distributor

etek europe

Etek Europe are Europe’s leading supplier of high quality, cost effective electronic manufacturing systems (EMS). Solutions include: Pick & place, Defluxing cleaning systems, X-ray, AXI and AOI imaging systems, Fume extraction service and support, LEV Testing and all your electronic production equipment consumables.

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T. +44(0)1292 834 000

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Contact our dedicated imaging team today where we will support you.

xReflow heat stage

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The systems are produced in Europe and hold all required global approvals including CE marking.

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